在SMT貼片加(jia)工(gong)中(zhong),元器件的貼裝(zhuang)質(zhi)量非(fei)常關鍵,因為它會影(ying)響到產品是(shi)否穩(wen)定。那么(me)世豪同創小(xiao)編來分享(xiang)一(yi)下影(ying)響SMT加(jia)工(gong)貼裝(zhuang)質(zhi)量的主(zhu)要因素。
一、組件要正確
在貼(tie)片(pian)加工中(zhong),要(yao)求(qiu)每個裝(zhuang)配號的(de)元件的(de)類型、型號、標稱值和極性(xing)等特(te)征標記要(yao)符合裝(zhuang)配圖和產(chan)品明(ming)細表的(de)要(yao)求(qiu),不能放在錯誤的(de)位置。
二、位置要準確
1、元器件(jian)的端子或引腳應盡量與焊盤(pan)圖(tu)形對齊并(bing)居(ju)中,并(bing)保(bao)證元器件(jian)焊端與焊膏圖(tu)形準確接(jie)觸;
2、元件貼(tie)裝位置應符(fu)合(he)工藝要(yao)求。
3、壓力(貼(tie)片高度)要正(zheng)確適當
貼(tie)片(pian)壓(ya)力(li)相當于吸嘴的(de)z軸(zhou)高(gao)(gao)度(du)(du)(du),其高(gao)(gao)度(du)(du)(du)要適中。如果(guo)貼(tie)片(pian)壓(ya)力(li)過小(xiao),元器(qi)件的(de)焊(han)端或引腳會浮(fu)在錫(xi)(xi)(xi)膏(gao)(gao)(gao)表(biao)面,錫(xi)(xi)(xi)膏(gao)(gao)(gao)不能(neng)粘在元器(qi)件上,轉(zhuan)移(yi)和回流(liu)焊(han)時(shi)容易移(yi)動位(wei)置。另外(wai),由于Z軸(zhou)高(gao)(gao)度(du)(du)(du)過高(gao)(gao),在芯(xin)片(pian)加工過程中,元器(qi)件從高(gao)(gao)處掉下(xia),會導致(zhi)芯(xin)片(pian)位(wei)置偏移(yi)。如果(guo)貼(tie)片(pian)壓(ya)力(li)過大,錫(xi)(xi)(xi)膏(gao)(gao)(gao)用(yong)量過多,容易造(zao)成錫(xi)(xi)(xi)膏(gao)(gao)(gao)粘連(lian),回流(liu)焊(han)時(shi)容易造(zao)成橋(qiao)接。
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