SMT生產線——按自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)化程(cheng)度(du)可分(fen)為(wei)(wei)全(quan)(quan)(quan)自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)生(sheng)(sheng)(sheng)產(chan)(chan)線(xian)(xian)(xian)(xian)和半(ban)自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)生(sheng)(sheng)(sheng)產(chan)(chan)線(xian)(xian)(xian)(xian)；根(gen)據(ju)生(sheng)(sheng)(sheng)產(chan)(chan)線(xian)(xian)(xian)(xian)的大小，可分(fen)為(wei)(wei)大、中、小型生(sheng)(sheng)(sheng)產(chan)(chan)線(xian)(xian)(xian)(xian)。全(quan)(quan)(quan)自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)生(sheng)(sheng)(sheng)產(chan)(chan)線(xian)(xian)(xian)(xian)是指整個生(sheng)(sheng)(sheng)產(chan)(chan)線(xian)(xian)(xian)(xian)設備為(wei)(wei)全(quan)(quan)(quan)自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)設備，所有(you)生(sheng)(sheng)(sheng)產(chan)(chan)設備通過自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)上料(liao)機、緩沖環節、卸(xie)(xie)料(liao)機連(lian)接(jie)成一(yi)條自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)線(xian)(xian)(xian)(xian)；半(ban)自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)生(sheng)(sheng)(sheng)產(chan)(chan)線(xian)(xian)(xian)(xian)是指主要生(sheng)(sheng)(sheng)產(chan)(chan)設備沒有(you)連(lian)接(jie)或完全(quan)(quan)(quan)連(lian)接(jie)。比如印刷(shua)機是半(ban)自(zi)(zi)動(dong)(dong)(dong)(dong)(dong)的，需要人(ren)工印刷(shua)或者人(ren)工裝卸(xie)(xie)印制(zhi)板。

典型(xing)生產線中涉及(ji)的工位解釋如(ru)下:

(1)印刷：其作(zuo)用是將焊膏或貼(tie)片膠漏到PCB的(de)(de)(de)焊盤上，為元器件的(de)(de)(de)焊接做準(zhun)備(bei)。使用的(de)(de)(de)設備(bei)是印刷機(ji)(鋼(gang)網(wang)印刷機(ji))，位于SMT生產線的(de)(de)(de)前(qian)端。

(2)點(dian)膠(jiao)(jiao)：將膠(jiao)(jiao)水滴在PCB的固定位置，主要作用是(shi)(shi)將元器件固定在PCB上。使用的設(she)備是(shi)(shi)一(yi)臺點(dian)膠(jiao)(jiao)機，位于(yu)SMT生產線的前(qian)面(mian)(mian)或(huo)測試設(she)備的后(hou)面(mian)(mian)。

(3)貼裝：其作用是將(jiang)表(biao)貼元(yuan)件準確地貼裝在PCB的固定位置上。使(shi)用的設備是一(yi)個貼片機，位于SMT生產線中的印刷機后面。

(4)固(gu)化(hua)(hua)：其(qi)作用是熔(rong)化(hua)(hua)貼片膠，使表面貼裝元件和PCB牢固(gu)地粘接在一起(qi)。使用的設(she)備是固(gu)化(hua)(hua)爐，位(wei)于SMT生產線中的貼片機(ji)后面。

(5)回流焊(han)：其(qi)作用是熔化錫(xi)膏，使(shi)表面貼裝(zhuang)元件和(he)PCB牢固地粘接在一起。使(shi)用的設(she)備(bei)是回流爐，位于SMT生產線中的貼片機(ji)后面。

(6)清洗：其作用(yong)是去除組裝好的PCB板上的助焊劑(ji)等對人體有害的焊接殘留物。使(shi)用(yong)的設備是清洗機，位(wei)置可以不固定，在線也可以離線。

(7)測(ce)試：其作用是測(ce)試組裝好(hao)的PCB板的焊接質(zhi)量(liang)和組裝質(zhi)量(liang)。使用的設備包括放大鏡、顯微鏡、在線測(ce)試儀(ICT)、飛針測(ce)試儀、自動光學檢測(ce)(AOI)、X射線檢測(ce)系統、功能測(ce)試儀等。根(gen)據測(ce)試的需要，其位(wei)置(zhi)可以配置(zhi)在生產線的合適位(wei)置(zhi)。

(8)返(fan)工(gong)：其作用是對(dui)檢測到古(gu)裝(zhuang)的(de)PCB板進行返(fan)工(gong)。使用的(de)工(gong)具有(you)烙鐵、維修(xiu)工(gong)作站等。在生產線(xian)的(de)任何地方進行配置。